1. Non-contact measurement using air.
  2. Can measure glass other than wafers (must be more than 700 μm thick).
  3. Wafer-only measurement part available as an option.
  4. Measuring range: 8.5mm long stroke.
  5. Measurement using manual movement between one center point and four perimeter points.
  6. Measurement data can be sent to a PC (option).
  7. Easy switching to 8-inch setup by changing a pin position.
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